Systems and high throughput methods for touch sensors

ABSTRACT

This disclosure generally relates to an electronic system comprising a touch sensor and a method for manufacturing such system. This disclosure also generally relates to an electronic system comprising a transparent conductive electrode. This disclosure also generally relates to an optoelectronic system including a touch screen. This system may comprise a conductive nano-composite layer, a lamination layer, and a transparent substrate. The conductive nano-composite layer, the lamination layer, and the transparent substrate in combination may have optical transparency higher than 88% at about 550 nm, and sheet resistance lower than 45 ohms per square.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.14/667,688, entitled “Systems and High Throughput Methods for TouchSensors,” filed Mar. 25, 2015. The entire content of this patentapplication is incorporated herein by reference.

BACKGROUND Technical Field

This disclosure generally relates to an electronic system comprising atouch sensor and a method for manufacturing such system. This disclosurealso generally relates to an electronic system comprising a transparentconductive electrode. This disclosure also generally relates to anoptoelectronic system including a touch screen.

Description of Related Art

Since touch screens provide an easy interface for human-machineinteractions, they recently have found wide range of applications inconsumer electronics, such as mobile phones, tablets, global positioningsystems (GPS), medical devices, laptops, point-of-sale terminals,point-of-information kiosks, industrial control units, and visualdisplay systems.

Among many types of the touch screens, capacitive touch screens aregetting more popular as compared to resistive touch screens due to theirhigher sensitivity to finger touch and good visibility for displays. Thecapacitive touch screens also allow users to perform functions notpossible with resistive touch screens such as changing the orientationof images with thumb and forefinger since they can support multi-touchcapability. For a summary of touch screen technologies and theirfeatures, for example, see publications by: Alfred Poor “How It Works:The Technology of Touch Screens” Computerworld, Oct. 17, 2012; GeoffWalker “Fundamentals of Touch Technologies” 2013 SID Touch GestureMotion Conference, October 2013; and Trevor Davis “Reducing CapacitiveTouchscreen Cost in Mobile Phones” Embedded, Feb. 25, 2013. The entirecontents of these publications are incorporated herein by reference.

A capacitive touch screen system typically comprises a cover glass (orlens) with a screen printed decorative frame, and a touch sensor madefrom indium tin oxide (ITO) film deposited on another glass substrate.These two components are separately manufactured and assembled to form asingle component by using an optically clear adhesive (OCA).Manufacturing of the currently available capacitive touch sensorinvolves in several process steps, including deposition of an ITO filmon a glass surface by sputtering, then baking the ITO film above itsmelting point to create a conductive ITO layer, and finally etching theconductive ITO layer by photo or laser lithography to form a sensingcircuit. Every manufacturing step adds to the cost of the final device,due to materials used and elongated manufacturing time. Since every stepmay have risks for causing defects, losses or decreasing productionyield further contribute to the overall cost. In addition, as the sizeof the capacitive touch screen increases, so does its weight since thetypical touch screen comprises two layers of glass. To achieve requiredtouch sensitivity of large size touch sensor, sheet resistance of thetransparent conducting electrode may need to be, for example, lower than50 ohm/square. For ITO coatings on a glass substrate, such a low sheetresistance may be achieved by increasing thickness of the conductivelayer while compromising transparency of the device.

Although use of ITO as an electrically conductive material dominates themanufacturing of the touch screens, the search for new materials thatcan replace ITO has been significantly intensified in the past fewyears, motivated by scarce supply of raw materials used in preparationof ITO films and ever increasing demand of consumer electronics product.Particularly, ITO based transparent conducting film may not meet therequirement of new products where light weight and great readability isessential.

Among several different approaches for manufacturing of alternativetransparent conducting electrodes, nanomaterial based transparentconducting electrodes including carbon nanotubes, graphene, andespecially metal nanowires are investigated as leading candidates.However, a number of challenges still exist before such an approach canmeet full manufacturing specifications including optical/electricalproperties and mechanical and environment stability. Especially lack ofan efficient manufacturing process with high throughput capacity is oneimportant hurdle.

Nanomaterials, especially metal nanowires may form a conductive networkfilm by random organization of individual nanowires. Sheet resistance,or electric conductivity of the film, is largely limited by the contactamong individual wires. In addition, adhesion of nanowire films to thetransparent substrate may be weak due to weak molecular interactionbetween the metal wires and the transparent substrate, such as glass andpolymer substrate. Efforts to improve adhesion without sacrificing theconductivity are reported in literature without much success. Forexample, in one approach, a binder material, vinyl chloride is added toa formulation conductive nanomaterial, carbon nanotube, as disclosed inGlatkowski et al. “Articles with Dispersed Conductive Coatings” U.S.Patent Application Publication No. 2006/0257638A1. The entire content ofthis disclosure is incorporated herein by reference.

Since most of the binder materials are insulators, they increase thecontact resistance between nanowires or nanotubes. In another approach,as disclosed in Alden et al. “Transparent Conductors Comprising MetalNanowires” U.S. Pat. No. 8,049,333; and “Nanowire Based TransparentNano-Conductors” U.S. Patent Application Publication No. 2008/0286447A1,silver nanowires were deposited on a substrate to form a nanowirenetwork, and then coated with a polymer matrix comprising acrylate andcarboxy alkyl cellulose ether polymers. The entire contents of thesedisclosures are incorporated herein by reference. Although suchapproaches might partially solve the adhesion problem, the surfaceconductivity of nanowire film would be lost.

The second major challenge is the stability of the nanowire films,particularly that of films comprising silver nanowires. When exposed tothe ambient atmosphere, pollutants in air, such as H₂S, may react withsilver nanowires to form electrically non-conductive silver sulfide.Oxidation of silver by oxygen to form silver oxide would contributeanother factor for instability of the touch sensors. An antioxidant isalso incorporated into the overcoat formulation to prevent directcontact of the silver nanowire film with atmospheric pollutants. Suchovercoats might slow down the penetration of the pollutants to thesilver nanowire film. The effectiveness of protection depends on theporosity of the overcoat and its thickness. However, as the thickness ofthe overcoat increase, the surface conductivity of the nanowire wouldalso be lost.

The third major challenge is related to the application of nanowirefilm. Continuous conductive electrode may need to be processed into apatterned sensor by widely used method such as photolithography or laserablation. Effective photo lithography methods to etch both overcoatpolymer and silver nanowire to form a touch sensor is disclosed inAllemand et al. “Nanowire-Based Transparent Conductors and ApplicationsThereof” U.S. Patent Application Publication No. 2014/0338735. Theentire content of this disclosure is incorporated herein by reference.Feasibility of the laser ablation of the silver nanowire has beendemonstrated, for example, see Hong Sukjoon et.al, Journal ofNanoscience and Nanotechnology, volume 15, no. 3, pages 2317-2323. Theentire content of this publication is incorporated herein by reference.However, because the overcoat layer is transparent, it may not beablated by the laser to allow evaporation and thereby removal of silverfrom the coating. Therefore most of the silver vapor formed by laserablation may be trapped underneath the overcoat, leading to crosstalk ofthe patterned lines and device failure.

To reduce the cost and the weight of the touch screen, several differenttouch screen structures are being developed, such as sensor on-cell typetouch screens, sensor in-cell type touch screens, glass lens/film sensortype touch screens, and sensor on glass lens or one glass solution (OGS)type touch screens. In these structures, main target is to reduce numberof layers of glass incorporated into the system, thereby reducing thetouch screen weight and costs.

However, there are still significant technical barriers for in-cell andon-cell type touch screens. For the on-cell type touch screens, theprimary issue is the noise injected from the display module, such asliquid crystal display (LCD). As the touch sensor is structured to becloser and closer to the thin film transistor (TFT) switching elementsof LCD, this noise substantially grows. In the case of in-cell typetouch screen, the touch sensor is implemented within the TFT structure,which is complicated to manufacture, and therefore this type of touchscreen is only used for a few high end applications today.

The glass lens/film type touch sensors are also manufactured by usingtwo separate processes to prepare cover lenses and film sensors, andassembling these two components by using an optically clear adhesive.Achieving required sheet resistance with polymer film substrates is moredifficult since the polymer films usually have lower thermal stabilitythan the glass substrates. And the ITO coating layer need to be annealedat a high temperature to achieve lower sheet resistance. Most widelyavailable ITO coatings on PET films have the sheet resistance of 150ohm/square at acceptable transparency of higher than 85% at 550 nm. Sucha high sheet resistance and a low transparency may only findapplications in small size touch sensors. ITO coatings on PET films withsheet resistances lower than 50 ohm/square are rarely available andexpensive.

The sensor on glass lens or one glass solution (OGS) approach may reducethe weight in overall device. This approach consolidates multilayertouch sensor system into a simpler structure and keeps supply chainsintact for consumer electronics manufacturers. However, it still faces anumber of technical challenges.

To be used as a glass lens, regular glass must be strengthened toprevent the breakage during the device use. The glass lens usuallyincludes a silk screen printed decorative frame on its inner surface.This frame is used to hide the circuitry of the device. These twofeatures of glass lens pose processing difficulties during the processscale up for commercialization. If the process scale up involvessputtering of an ITO layer on a large strengthened glass followed bypatterning of the ITO layer, there may be substantial losses duringcutting of the large strengthened glasses into small devices, decreasingthe process yield. If the process involves small pieces of thestrengthened glass, the productivity may dramatically drop.

Furthermore, the silk screen printed decorative frame usually has about5 micrometers to 10 micrometers thickness. This frame prevents the ITOlayer to form a uniform and continuous film during the ITO sputteringprocess across the glass and over the silk screen printed area. Anydisruption in the conductive layer, at the frame to the glass transitionregions, would cause device failures. This process may therefore beunsatisfactory.

SUMMARY

This disclosure generally relates to an electronic system comprising atouch sensor and a method for manufacturing such system. This disclosurealso generally relates to an electronic system comprising a transparentconductive electrode. This disclosure also generally relates to anoptoelectronic system including a touch screen.

The electronic system may comprise a conductive nano-composite layer, alamination layer, and a transparent substrate. The conductivenano-composite layer, the lamination layer, and the transparentsubstrate each have a front surface and a back surface. The laminationlayer may be formed on the front surface of the transparent substrate.The conductive nano-composite layer may be formed on the front surfaceof the lamination layer. In this system, the lamination layer may bepositioned between the conductive nano-composite layer and thetransparent substrate.

The conductive nano-composite layer may comprise a polymer. Thelamination layer may comprise a polymer. The polymer may comprisepolyacrylate, polymethacrylate, polyurethaneacrylate, polyisocyanurateacrylate, polyepoxide, or any combination thereof. In one example, boththe conductive nano-composite layer and the lamination layer maycomprise the same polymer. Both the conductive nano-composite layer andthe lamination layer comprise polyacrylate, polymethacrylate,polyurethaneacrylate, polyisocyanurate acrylate, polyepoxide, or anycombination thereof.

The conductive nano-material layer may comprise a nanomaterial. Thenanomaterial may comprise a nanowire, a nanoribbon, a nanotube, ananoparticle, or any combination thereof. The nanomaterial may alsocomprise a metal nanowire, a carbon nanotube, a graphene nanoribbon, orany combination thereof. The metal nanowire may comprise a silvernanowire, a copper nanowire, a gold nanowire, a stainless steelnanowire, or any combination thereof.

The transparent substrate may comprise poly(ethylene terephthalate)(PET), poly(methyl methacrylate) (PMMA), polycarbonate (PC),poly(ethylene naphthalate) (PEN), cellulose triacetate (TAC), polyimide(PI), or any combination thereof.

The system may also comprise a protective film. The protective film maybe formed on the front surface of the conductive nano-composite layer.In this system, the conductive nano-composite layer may be positionedbetween the protective film and the lamination layer.

The system may also comprise a hard coat formed on the back surface ofthe transparent substrate. The hard coat may have a front surface and aback surface. In this system, the transparent substrate may bepositioned between the lamination layer and the hard coat.

The system may also comprise a functional coating formed on the backsurface of the hard coat. In this system, the hard coat may bepositioned between the transparent substrate and the functional coating.The functional coating may comprise an antireflective layer, anantiglare layer, or any combination thereof.

The conductive nano-composite layer, the lamination layer, and thetransparent substrate may form a component. Optical transparency of saidcomponent may be higher than 85% at about 550 nm. In another example,optical transparency of said component may be higher than 88% at about550 nm. Sheet resistance of said component may be lower than 45 ohms persquare.

The conductive nano-composite layer, the lamination layer, thetransparent substrate, and the hard coat may form another component.Optical transparency of said component may be higher than 85% at about550 nm. In another example, optical transparency of said component maybe higher than 88% at about 550 nm. Sheet resistance of said componentmay be lower than 45 ohms per square.

The conductive nano-composite layer, the lamination layer, and thetransparent substrate may form a component. Sheet resistance of saidcomponent may be lower than 70 ohms per square after said component isheated at a relative humidity of about 90% and at a temperature of about60 degrees in centigrade for about 240 hours, or heated at a temperatureof about 80 degrees in centigrade for about 240 hours.

The conductive nano-composite layer may be patterned such that thesystem can detect a touch. The conductive nano-composite layer may bepatterned by removal of a material from the conductive nano-compositelayer such that the system can detect a touch. The conductivenano-material layer may comprise a nanomaterial, and may be patterned byremoval of the nanomaterial from the conductive nano-composite layerwith a predetermined amount such that the system can detect a touch. Thenanomaterial may comprise a silver nanowire. The patterning of theconductive nano-composite layer may form a touch sensor.

The system may be a display system comprising the touch sensor. Thedisplay system may be a liquid crystal display, a light emittingdisplay, a light emitting organic display, a plasma display, anelectrochromic display, an electrophoretic display, an electrowettingdisplay, an electrofluidic display, or an combination thereof.

The system may also comprise an encapsulation layer formed on the frontsurface of the conductive nano-composite layer. The conductivenano-composite layer may be positioned between the encapsulation layerand the lamination layer.

The system may also comprise an area formed on the front surface of theconductive nano-composite layer that has a configuration to allowbonding of an integrated circuit with the conductive nano-compositelayer.

The encapsulation layer may comprise a polymer. The lamination layer maycomprise a polymer. The polymer may comprise polyacrylate,polymethacrylate, polyurethaneacrylate, polyisocyanurate acrylate,polyepoxide, or any combination thereof. In one example, both theencapsulation layer and the lamination layer may comprise the samepolymer. The same polymer may comprise polyacrylate, polymethacrylate,polyurethaneacrylate, polyisocyanurate acrylate, polyepoxide, or anycombination thereof. In another example, the encapsulation layer, thelamination layer, the conductive nano-composite layer may comprise thesame polymer. The same polymer may comprise polyacrylate,polymethacrylate, polyurethaneacrylate, polyisocyanurate acrylate,polyepoxide, or any combination thereof.

A process for making the electronic system may comprise providing afirst component by a process comprising forming an electricallyconductive nano-composite layer on a first protective film, providing atransparent substrate, and providing a liquid lamination layer betweenthe first component and the transparent substrate. The process mayfurther comprise bringing the liquid lamination layer in contact withthe first component and the transparent substrate, and curing the liquidlamination layer. A transparent conductive electrode may thereby beprepared.

The lamination liquid layer may comprise monomers that have one or moreUV curable functional groups. The monomers may be acrylates,methacrylates, acrylic acids, methacrylic acids, urethane acrylates,acrylamides, methacrylamides, styrenes, methyl styrenes, isocyanurateacrylates, polyester acrylates, polyurethane acrylates, polyimideacrylates, epoxides, or a mixture thereof. The lamination liquid layermay further comprise a catalyst suitable for a UV curing of the monomerand an antioxidant.

The process may further comprise forming a hard coat on the transparentsubstrate before bringing the liquid lamination layer in contact withthe first component and the transparent substrate. The process may alsofurther comprise forming a functional coating on the hard coat.

The process of providing the first component may further compriseforming the liquid lamination layer on the conductive nanomateriallayer.

The process may further comprise bringing the liquid lamination layer incontact with the transparent substrate before bringing the liquidlamination layer in contact with the first component.

The electrically conductive layer may comprise a nanomaterial. And theprocess may further comprise partially removing the nanomaterial with apredetermined amount from the electrically conductive nano-compositelayer in such a manner that the system can detect a touch. Thenanomaterial may be removed by using a laser lithography process. Atouch sensor may thereby be formed.

The process may further comprise providing a second component by aprocess comprising forming a primer layer on a second protective film.The formed primer layer may partially cover surface of the protectivefilm. The process may further comprise providing a liquid encapsulationlayer, bringing the liquid encapsulation layer in contact with thesecond component and the touch sensor, curing the liquid encapsulationlayer, and peeling off the protective film. An encapsulated touch sensormay thereby be prepared.

The lamination liquid layer and the liquid encapsulation layer maycomprise monomers that have one or more UV curable functional groups.The monomers may be acrylates, methacrylates, acrylic acids, methacrylicacids, urethane acrylates, acrylamides, methacrylamides, styrenes,methyl styrenes, isocyanurate acrylates, polyester acrylates,polyurethane acrylates, polyimide acrylates, epoxides, or a mixturethereof. The lamination liquid layer and the liquid encapsulation layermay further comprise a catalyst suitable for a UV curing of the monomerand an antioxidant.

Any combination of above features, systems, devices, and methods arewithin the scope of this disclosure.

These, as well as other components, steps, features, objects, benefits,and advantages will now become clear from a review of the followingdetailed description of illustrative embodiments, the accompanyingdrawings, and the claims.

BRIEF DESCRIPTION OF DRAWINGS

The drawings disclose illustrative embodiments. They do not set forthall embodiments. Other embodiments may be used in addition or instead.Details which may be apparent or unnecessary may be omitted to savespace or for more effective illustration. Conversely, some embodimentsmay be practiced without all of the details which are disclosed. Whenthe same numeral appears in different drawings, it refers to the same orlike components or steps.

The following reference numerals are used in FIGS. 1-11 and 13-15: touchsensor 101, transparent conductive electrode 102, encapsulated touchsensor 103, sensor layer 104, lamination layer 105, transparentsubstrate 106, conductive nano-composite layer 107, hard coat 108,functional coating 109, protective film 110, encapsulation layer 111,bonding area 112, conductive nanomaterial layer 113, liquid laminationlayer 114, lamination liquid and conductive nanomaterial mixing layer115, “component 1” 116, liquid encapsulation layer 117, primer layer118, “component 2” 119, “component 3” 120, “component 4” 121, “component5” 122, “component 6” 123, and “component 7” 124.

FIG. 1 is a drawing of an exemplary system comprising a touch sensorcomprising a sensor layer, a lamination layer, and a transparentsubstrate. Features shown in this cross-sectional view of the system arenot drawn to scale.

FIG. 2 is a drawing of an exemplary system comprising a transparentconductive electrode comprising a conductive nano-composite layer, alamination layer, and a transparent substrate. Features shown in thiscross-sectional view of the system are not drawn to scale.

FIG. 3 is a drawing of an exemplary system comprising a touch sensorcomprising a sensor layer, a lamination layer, a transparent substrate,a hard coat, and a functional coating. Features shown in thiscross-sectional view of the system are not drawn to scale.

FIG. 4 is a drawing of an exemplary system comprising a transparentconductive electrode comprising a protective film, a conductivenano-composite layer, a lamination layer, a transparent substrate, ahard coat, and a functional coating. Features shown in thiscross-sectional view of the system are not drawn to scale.

FIG. 5 is a drawing of an exemplary system comprising an encapsulationlayer, a sensor layer, a lamination layer, a transparent substrate, ahard coat, and a functional coating. This exemplary system alsocomprises a bonding area formed on the sensor layer that allows forintegration of the system to an integrated circuit (IC). This exemplarysystem may be used as an encapsulated touch sensor. Features shown inthis cross-sectional view of the system are not drawn to scale.

FIG. 6 is a drawing of an exemplary method of forming a component 1 andcomponent 2. Features shown in this cross-sectional view of the systemcomprising the component 1 and component 2 are not drawn to scale.

FIG. 7 is a drawing of an exemplary method of forming a component 3.Features shown in this cross-sectional view of the system comprising thecomponent 3 are not drawn to scale.

FIG. 8 is a drawing of an exemplary method of forming a systemcomprising an exemplary transparent conductive electrode. Features shownin this cross-sectional view of said system are not drawn to scale.

FIG. 9 is a drawing of an exemplary method of forming a component 1.Features shown in this cross-sectional view of the system comprising thecomponent 1 and component 2 are not drawn to scale.

FIG. 10 is a drawing of an exemplary method of forming a component 3 anda component 4. Features shown in this cross-sectional view of the systemcomprising the component 3 and component 4 are not drawn to scale.

FIG. 11 is a drawing of an exemplary method of forming a systemcomprising an exemplary transparent conductive electrode. Features shownin this cross-sectional view of said system are not drawn to scale.

FIG. 12 is a drawing of an exemplary manufacturing system that may beused in manufacturing of the exemplary systems described in thisdisclosure.

FIG. 13 is a drawing of an exemplary method of forming a systemcomprising an exemplary touch sensor. Features shown in thiscross-sectional view of said system are not drawn to scale.

FIG. 14 is a drawing of an exemplary method of forming a component 5.Features shown in this cross-sectional view of the component 5 are notdrawn to scale.

FIG. 15 is a drawing of an exemplary method of forming an exemplaryencapsulated touch sensor. Features shown in this cross-sectional viewof the component 5 are not drawn to scale.

FIG. 16 is a graph showing optical transparencies of an exemplary system(“Sample”) and the transparent substrate used in manufacturing of thissystem poly(ethylene terephthalate) (“PET”).

FIG. 17 is a graph showing optical transparency of an exemplary system(“Sample”) and the transparent substrate used in manufacturing of thissystem poly(ethylene terephthalate) (“PET”) that has a hard coat layer.

FIG. 18 is a graph showing optical transparency of an exemplary system(“Sample”) and the transparent substrate used in manufacturing of thissystem (“PMMA”).

FIG. 19 is a graph showing optical transparency of four exemplarysystems (“Sample 1” to “Sample 4”) and the transparent substrate used inmanufacturing of this system (“PMMA”).

FIG. 20 is a microscopic photograph showing an exemplary touch sensorformed on a PET film. The width of each line is around 30 micrometers.

FIG. 21 is a microscopic photograph showing an exemplary touch sensor ona PMMA substrate. The width of each line is about 30 micrometers.

FIG. 22 is a microscopic photograph showing an exemplary bonding area ofencapsulated touch sensor on a PET film. The width of each line is about30 micrometers.

FIG. 23 is a microscopic photograph showing an exemplary bonding area ofencapsulated touch sensor on a PMMA substrate. The width of each line isabout 30 micrometers.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

Illustrative embodiments are now discussed. Other embodiments may beused in addition or instead. Details which may be apparent orunnecessary may be omitted to save space or for a more effectivepresentation. Conversely, some embodiments may be practiced without allof the details which are disclosed.

In this disclosure, the word “form” may mean “deposit”, “coat”,“dispose”, “laminate”, “apply”, “place”, “provide”, “position”, or thelike. The phrase “any combination thereof” may mean “a mixture thereof”,“a composite thereof”, “an alloy thereof”, or the like. In thisdisclosure, the indefinite article “a” and phrases “one or more” and “atleast one” are synonymous and mean “at least one”.

The present disclosure relates to a U.S. patent application to HailiangWang, entitled “Systems and Methods for Touch Sensors on PolymerLenses”, U.S. patent application Ser. No. 14/224,838; filed Mar. 25,2014. The entire content of this patent application is incorporatedherein by reference.

This disclosure generally relates to an electronic system comprising atouch sensor and a method for manufacturing such system. This disclosurealso generally relates to an electronic system comprising a transparentconductive electrode. This disclosure also generally relates to anoptoelectronic system including a touch screen.

This disclosure provides touch sensors and transparent conductiveelectrodes with high optical transmittance and low electricalresistance. This disclosure further provides high throughputmanufacturing methods for such touch sensors and electrodes. Bettertouch sensors and electrodes with improved optical and electricalproperties at a lower price may thereby be obtained.

The present disclosure also generally relates to optoelectronic systemsincluding touch screens and displays, particularly to systems such asliquid-crystal displays (LCD), light emitting displays (LED), organiclight emitting displays (OLED), polymer light emitting displays (PLED),plasma displays, electrochromic displays, and the like, which maycomprise the touch sensors or the transparent conductive electrodes. Theelectronic system of current disclosure also relates to electrophoreticdisplays, electrowetting displays, electrofluidic displays and otherbistable displays such as those incorporated into e-paper, Kindlereaders, and the like, which may comprise the touch sensors or thetransparent conductive electrodes.

The present disclosure generally relates to an electronic systemcomprising a touch sensor. An example of such touch sensor is shown inFIG. 1. The touch sensor may comprise a sensor layer, a laminationlayer, and a transparent substrate. Each layer of the touch sensor mayhave a back surface and a front surface. That is, the sensor layer, thelamination layer, and the transparent substrate each may have a backsurface and a front surface. The lamination layer may be formed on thefront surface of the transparent substrate. The sensor layer may beformed on the front surface of the lamination layer. The laminationlayer is positioned between the sensor layer and the transparentsubstrate.

The present disclosure also generally relates to an electronic systemcomprising a transparent conductive electrode. An example of suchtransparent conductive electrode is shown in FIG. 2. The transparentconductive electrode may comprise a conductive nano-composite layer, alamination layer, and a transparent substrate. Each layer of thetransparent conductive electrode may have a back surface and a frontsurface. That is, the conductive nano-composite layer, the laminationlayer, and the transparent substrate each may have a back surface and afront surface. The lamination layer may be formed on the front surfaceof the transparent substrate. The conductive nano-composite layer may beformed on the front surface of the lamination layer. The laminationlayer is positioned between the conductive nano-composite layer and thetransparent substrate.

The transparent conducting electrode may be used in manufacturing ofwide range of electronic devices, especially consumer electronics suchas mobile phones, tablet computers, and laptops.

The sensor layer may be formed by patterning the conductivenano-composite layer such that the electronic system can detect a touch.The sensor layer may also be formed without patterning the conductivenano-composite layer. Thus, the touch sensor of this disclosure maycomprise the conductive nano-composite layer or the patterned conductivenano-composite layer. Both systems are within the scope of thisdisclosure.

In general, the touch sensor may recognize the touch and position of thetouch on a surface of the electronic system (“touch-sensitive surface”).Examples of such touches may include touching of fingers or otherobjects upon the touch-sensitive surface. The electronic system mayinclude an array of such touch sensors capable of detecting touches.These systems may be able to detect multiple touches (e.g. the touchingof fingers or other objects upon the touch-sensitive surface at distinctlocations at about the same time) and near touches (e.g. fingers orother objects close to the touch-sensitive surface), and identify andtrack their locations.

The touch sensor or the transparent conductive electrode may have anyshape. They may be flat or curved. For example, they may have concaveshapes, convex shapes, flat shapes, or a combination of these shapes.

The conductive nano-composite layer may comprise a nanomaterial. Thenanomaterial may comprise an electrically conductive nanomaterial.Examples of the electrically conductive nanomaterial may be a nanowire,a nanoribbon, a nanotube, a nanoparticle, and any combinations thereof.Examples of such materials may be silver, gold, platinum, copper,aluminum, nickel, stainless steel, carbon, and any combinations thereof.Examples of carbon may be single wall or multiwall carbon nanotube,graphene, and any combinations thereof. Other examples of suchelectrically conductive materials may be electrically conductivepolymers such as polypyrrole, polyaniline, polythiophene,poly(3-methylthiophene), poly(3,4-ethylenedioxythiophene), and anycombinations thereof. Further examples of such electrically conductivematerials may be electrically conductive ceramics such as indium tinoxide (ITO). Any combinations of these electrically conductive materialsmay be used in manufacturing of the system comprising the touch sensoror the transparent conductive electrode. Thus, examples of ananomaterial may be a silver nanowire, a gold nanowire, a coppernanowire, an ITO nanowire, a single wall carbon nanotube (SWCN), amulti-wall carbon nanotube (MWCN), a graphene nanoribbon, a carbonfiber, a conducting polymer, and any mixtures thereof. The smallestdimension of the at least one nanomaterial may vary in the range of 10nanometers (nm) to 1,000 nm. The smallest dimension of the at least onenanomaterial may also vary in the range of 10 nm to 200 nm.

The conductive nano-composite layer may further comprise a polymer(“nano-composite layer polymer”). The nano-composite layer polymer maybe any polymer suitable for manufacturing of the touch sensor or thetransparent conductive electrode. The nano-composite layer polymer maynot be an electrically conductive polymer. Examples of such polymer arepolyacrylate, polymethacrylate, polyacrylic acid, polymethacrylic acid,polyacrylamide, polymethacrylamide, polystyrene, polymethyl styrene,polyester acrylate, polyurethane acrylate, polyisocyanurate acrylate,polyimide acrylate, polyepoxide, and any combination thereof.

The nano-composite layer polymer may provide structural strength,adhesive strength, and/or protection to the touch sensor or thetransparent conductive electrode. For example, the nano-composite layerpolymer may form a composite with the nanomaterial that providesprotection for the nanomaterial that may be mechanically weak. Thiscomposite may be in the form of a sheet or a layer that may havesufficient mechanical strength to withstand handling during themanufacturing and/or use of the electronic system. In another example,this nano-composite layer polymer may provide sufficient adhesivestrength for adhesion of the conductive nano-composite layer with thelamination layer. In one example, the sensor layer or the conductivenano-composite layer may be formed by a laminating process in which theat least one nanomaterial layer (mesh) is mixed with a coatingcomprising monomers, oligomers, polymers, or combinations thereof. Themonomers or oligomers may form the conductive nano-composite layerthrough polymerization of these monomers, oligomers, for example, usingUV or thermal curing processes.

Thickness of the sensor layer or the conductive nano-composite layer mayvary in the range of 5 nanometers to 1000 nanometers, or in the range of30 nanometers to 100 nanometers.

The lamination layer may comprise any polymer (“lamination layerpolymer”). The lamination layer polymer may not comprise an electricallyconductive polymer. Examples of the lamination layer polymer may bepolyacrylate, polymethacrylate, polyacrylic acids, polymethacrylicacids, polyacrylamide, polymethacrylamide, polystyrene, polymethylstyrene, polyester acrylate, polyurethane acrylate, polyisocyanurateacrylate, polyimide acrylate, polyepoxides, and any combination thereof.The lamination layer may have any shape. It may be flat or curved. Forexample, it may have a concave shape, a convex shape, a flat shape, or acombination of these shapes. Thickness of lamination layer may vary inthe range of 1 nanometer to 50 micrometers, or in the range of 10nanometers to 10 micrometers.

The transparent substrate of the present disclosure may be anytransparent polymer. Examples of the polymers for the transparentsubstrate may be poly(ethylene terephthalate) (PET), poly(methylmethacrylate) (PMMA), polycarbonate (PC), poly(ethylene naphthalate)(PEN), cellulose triacetate (TAC), polyimide (PI), and any combinationthereof.

The transparent substrate may have any shape. It may be flat or curved.For example, it may have a concave shape, a convex shape, a flat shape,or a combination of these shapes. The transparent substrate may beflexible or rigid. The transparent substrate may have a lighttransmittance of at least 85%, at least 90%, or at least 92% at 550 nm.Thickness of the transparent substrate may vary in the range of 0.01millimeter (mm) to 6 mm. For a flexible transparent substrate, thethickness may also vary in the range of 0.01 mm to 0.150 mm. For a rigidtransparent substrate, the thickness may also vary in the range of 0.5mm to 1 mm.

A transparent polymer substrate may provide better physical and/orchemical properties than the transparent glass substrate. For example, apolymer may have similar or higher dielectric constant than a glass. Ingeneral, polymers may be less fragile as compared to glasses. Mechanicalstrength of polymers may be much higher than those of glasses. Forexample, mechanical strength of PMMA is 17 times higher than that of theregular glass. PC may also have higher impact strength than the PMMA.Polymer substrate may have similar or higher optical transparency than aglass substrate. For example, the light transmittance of PMMA at visiblelight wavelengths is similar to or higher than the glass. Furthermore,the touch sensor comprising the transparent polymer substrate may belighter in weight as compared to that comprising a glass. For example,PMMA has a density varying in the range of 1.17 g/cm³ to 1.20 g/cm³,which is lower than the glass density. Also, it may be easier toprocess, e.g. cut, shape, and/or form the polymer substrate as comparedto the glass substrate, which may decrease the manufacturing cost of thesystem.

The electronic system may further comprise a hard coat to providescratch-resistance and abrasion resistance properties to the transparentsubstrate. The hard coat may have a front surface and a back surface.Examples of such system comprising the hard coat are shown in FIGS. 3-4.The hard coat may be formed on the back surface of the transparentsubstrate. In this example of the electronic system, the transparentsubstrate is positioned between the lamination layer and the hard coat.

The hard coat may prevent or minimize formation of scratches during thefabrication of the system and its handling by end user, therebyincreasing the system durability. The hard coat may be formed on theback surface of the transparent substrate. The thickness of the hardcoat may vary in the range of 2 micrometers to 15 micrometers. Thethickness of the hard coat may also vary in the range of 5 micrometersto 10 micrometers.

The system may further comprise a functional coating. The functionalcoating may have a front surface and a back surface. Examples of suchsystem are shown in FIGS. 3-4. The functional coating may be formed onthe back surface of the hard coat. In this example of the electronicsystem, the hard coat is positioned between the transparent substrateand the functional coating.

The functional coating may provide additional optical and/or protectiveproperties to the electronic system. Examples of such optical coatingcoatings may be antireflection coatings, antiglare coatings, andcombinations thereof. Examples of such protective coatings may beantistatic coatings, anti-stain coatings, hydrophobic coatings,fingerprint proof coatings, and combinations thereof. The at least onefunctional coating may be formed on the surface of the hard coat by anysolution deposition method, such as dip coating, spray coating, Mayerrod coating, slot die coating, screen printing, and other traditionalcoating methods followed by any suitable curing method such as thermalcuring, ultraviolet (UV) curing, infrared (IR) curing and the like.

An antireflective coating may improve transparency of the electronicsystem. The antireflective coating may comprise an antireflective layer.The antireflective coating may be formed on a hard coat layer or onanother functional coating. Formulations and methods of deposition ofmultilayer antireflection coatings are known in the art. For example,see publications: U.S. Patent Application Publication No. 2014/0038109“Antireflective Coating Composition and Process Thereof” to Rahman, D.M. et. al.; U.S. Patent Application Publication No. 2014/0009834 “NovelAntireflective Coatings with Graded Refractive Index” to Kalyankar, N.D.; U.S. Patent Application Publication No. 2013/0164545 “Compositionsfor Antireflective Coatings” to Evans, J. P. et al.; U.S. PatentApplication Publication No. 2013/0095237 “Sol-Gel Based AntireflectiveCoatings Using Alkyltrialkoxysilane Binders Having Low Refractive Indexand High Durability” Kalyankar, N. D. et al.; U.S. Patent ApplicationPublication No. 2014/0051804(A1) “Polysilanesiloxane Resins for Use inan Antireflective Coating” to Xiaobing Zhou et al.; and U.S. PatentApplication Publication No. 2014/0023840(A1) “Antireflection Film andMethod of Producing Same” to Shibayama, N. et al. The entire contents ofthese publications are incorporated herein by reference.

The readability of the device may be improved by adding an antiglarecoating on the surface of the hard coat. Formulation and method ofapplying antiglare coating on the surface of the hard coat is known inthe art. For example, see publications: U.S. Patent ApplicationPublication No. 2013/0286478 “Anti-Glare Film, Method for ProducingAnti-Glare Film, Polarizer and Image Display Device” to Furui, G. etal.; U.S. Patent Application Publication No. 2013/0230733 “ResinParticles and Process for Producing Same, Antiglare Film,Light-Diffusing Resin Composition, and External Preparation” toNakamura, M. et al.; U.S. Patent Application Publication No.2012/0177920 “Antiglare and Antiseptic Coating Material and TouchscreenCoated with the Same” to Huang, Y. H.; U.S. Patent ApplicationPublication No. 2012/0141736 “Antiglare Hard Coat Film” to Hotta, T. et.al.; U.S. Patent Application Publication No. 2013/0250414(A1) “AntiglareFilm, Polarizer, and Image Display Device” to Eguchi, J. et al.; andU.S. Patent Application Publication No. 2013/0088779(A1) “Antireflectiveand Antiglare Coating Composition, Antireflective and Antiglare Film,and Method for Producing Same” to Kang, J. K. et al. The entire contentsof these publications are incorporated herein by reference.

Anti-fingerprint coatings are also known as a type of functionalcoatings in the art. For example see publications: U.S. PatentApplication Publication No. 2014/0030488 “Panel with Anti-FingerprintProperty and Manufacturing Method Thereof” to Jung, D. et al.; and U.S.Patent Application Publication No. 2013/0157008 “Anti-FingerprintCoatings” to Aytug, T. et al. The entire contents of these publicationsare incorporated herein by reference.

The electronic system may further comprise a protective film. An exampleof this system is shown in FIG. 4. The protective film may have a frontsurface and a back surface. The protective film may be formed on thefront surface of the conductive nano-composite layer or the sensorlayer. In this system, the conductive nano-composite layer may bepositioned between the protective film and the lamination layer. Or, inthis system, the sensor layer may be positioned between the protectivefilm and the lamination layer. The protective film may provide amechanical protection to the transparent conductive electrode, therebypreventing damage to the electrode during its handling. Also, theprotective film may isolate the transparent nano-conductive layer fromthe ambient air. Therefore, environment stability of the transparentconductive electrode may greatly be enhanced.

The protective film may comprise any polymer (“the protective filmpolymer”). The protective film polymer may not be a conductive polymer.The electronic system may further comprise an encapsulation layer. Anexample of such a system is shown in FIG. 5. The encapsulation layer mayhave a front surface and a back surface. The encapsulation layer may beformed on the front surface of the conductive nano-composite layer orthe sensor layer. In this system, the conductive nano-composite layermay be positioned between the encapsulation layer and the laminationlayer. Or, in this system, the sensor layer may be positioned betweenthe encapsulation layer and the lamination layer.

The encapsulation layer may comprise any polymer (“the encapsulationlayer polymer”). The encapsulation layer polymer may be a transparentpolymer. The encapsulation layer polymer may not be an electricallyconductive polymer. Examples of the encapsulation layer polymer may bepolyacrylate, polymethacrylate, polyacrylic acid, polymethacrylic acid,polyacrylamide, polymethacrylamide, polystyrene, polymethyl styrene,polyester acrylate, polyurethane acrylate, polyimide acrylate,polyisocyanurate acrylate, polyepoxides, and any combination thereof.Thickness of the encapsulation layer may vary in the range of 0.1micrometer to 50 micrometers, or in the range of 1 micrometer to 10micrometers.

The electronic system may further comprise an area formed on the frontsurface of the conductive nano-composite layer or the sensor layer(“bonding area”). An example of such system is shown in FIG. 5. Thebonding area may be used to bond an integrated circuit with theconductive nano-composite layer or the sensor layer.

The touch sensor or the transparent conductive electrode may bemanufactured by any suitable method. Examples of such method aredisclosed below.

The disclosure is illustrated further by the following additionalexamples that are not to be construed as limiting the disclosure inscope to the specific procedures or products described in them.

Example 1. Preparation of a Transparent Conductive Electrode

In this example, a method for preparation of a transparent conductiveelectrode is disclosed. This exemplary method is shown in FIGS. 6-8. Thefollowing reference numerals are used in FIGS. 6-8: transparentconductive electrode 102, lamination layer 105, transparent substrate106, conductive nano-composite layer 107, hard coat 108, functionalcoating 109, protective film 110, conductive nanomaterial layer 113,liquid lamination layer 114, lamination liquid and conductivenanomaterial mixing layer 115, “component 1” 116, “component 2” 119, and“component 3” 120.

In this example, a protective film may be provided, as shown in FIG. 6.The protective film may be a film with a low coefficient of linearthermal expansion. The protective film may have a linear thermalexpansion of less than 1.5% at 150 degrees centigrade, less than 0.8% at150 degrees centigrade, or less than 0.5% at 150 degrees centigrade. Theprotective film may comprise any polymer (“the protective filmpolymer”). Examples of the protective film polymer may be poly (ethyleneterephthalate) (PET), polycarbonate (PC), poly(ethylene naphthalate)(PEN), triacetylcellulose (TAC) and any combination thereof. Thicknessof the protective film may vary in the range of 0.01 millimeter (mm) to0.250 mm, or in the range of 0.01 mm to 0.150 mm.

In this example, a liquid formulation of the electrically conductivenanomaterial (“nanomaterial dispersion”) may be prepared as follows. Inthis preparation, the electrically conductive nanomaterial is mixed witha compatible solvent. Examples of the electrically conductivenanomaterial may be a nanowire, a nanoribbon, a nanotube, ananoparticle, and any combinations thereof. Further examples of theelectrically conductive nanomaterial are disclosed above.

The solvent may be water or an organic solvent. Examples of organicsolvents may be alcohols, ketones, ethers, esters, acetates, and themixtures thereof. Examples of organic solvents may also be methanol,ethanol, isopropanol, 2-methoxyethanol, 1-methoxy-2-propanol, ethylacetate, n-butyl acetate, t-butyl acetate, 2-propoxyethanol, propyleneglycol monomethyl ether acetate, and mixtures thereof. Solid content ofthe electrically conductive nanomaterial (for example, a nanowire) inthe formulation may vary in the range of 0.1 milligram/milliliter(mg/ml) to 10 mg/ml. The solid content of the nanomaterial in thedispersion may also vary in the range of 1 mg/ml to 5 mg/ml. Adispersant may also be added to the nanomaterial dispersion.

The nanomaterial dispersion may be deposited on a surface of theprotective film by any web coating method known in the art. Examples ofthese deposition methods may be slot die coating method, Mayer rodcoating method, gravure or reverse gravure method, micro-gravure coatingmethod and any combination of such methods. Such coating methods may useany commercially available equipment. For example, the slot die coatingmethod may be used for coating of nanomaterial dispersion with goodprecision.

After the liquid nanomaterial dispersion is deposited on the protectivefilm, the protective film may be thermally treated to remove the solventand thereby to form a solid conductive nanomaterial layer on the surfaceof the protective film, as shown in FIG. 6-1A. The thermal treatment ofthe liquid nanomaterial coating may be achieved by any suitable method,including regular or infrared (IR) heating in a tunnel oven. The thermaltreatment temperature and time, length of the tunnel oven, and speed ofthe web coating may be adjusted to completely or substantially removethe solvent from the wet coating by evaporation, and anneal theconductive nanomaterial layer without deteriorating the dimensionalstability of the protective film. For example, the tunnel oventemperature may be kept in the range of 100 degree centigrade to 150degree centigrade for a PET protective film, or kept in the range of 100degree centigrade to 200 degree centigrade for a polyimide protectivefilm. The thermal treatment time may be less than 30 minutes, or lessthan 5 minutes. After the thermal treatment, a “component 1” comprisingthe conductive nanomaterial layer and the protective film may thereby beprepared.

Then, the component 1 may be coated with a liquid lamination layer asshown in FIG. 6-1B. A liquid lamination formulation may comprise amonomer or an oligomer, and a curing catalyst. The laminationformulation may also comprise a monofunctional monomer, a di-functionalmonomer, and a tri-functional monomer; and a compatible curing catalyst.For example, composition of the lamination formulation may comprise themono-functional monomer (1% to 50%), di-functional monomer (10% to 80%),tri-functional monomer (1% to 50%), a curing catalyst (1% to 6%), aleveling agent (0.1% to 0.3%), and an antioxidant (0.1% to 0.3%) weightpercentage.

Examples of monomers suitable for preparation of the laminationformulation may be acrylate, methacrylate, acrylic acid, methacrylicacid, urethane acrylate, acrylamide, methacrylamide, styrene, methylstyrene, isocyanurate acrylate polyester acrylate, polyurethaneacrylate, polyimide acrylate, various epoxides, and a mixture thereof.Examples of the curing catalyst may be a free radical catalyst such asbenzoin, benzoin alkyl ethers, acylphosphine oxides,1,1-diethoxyacetophenone, 1-benzoylcyclohexanol, benzophenone,2,2-dimethoxy-2-phenylacetophenone,2-methyl-1-[4-(methylthio)phenyl]-2-(4-morpholinyl)-1-propanone,1-hydroxycyclohexyl phenyl ketone, and the like; cationic UV curingcatalysts such as diaryliodonium salt, dialkylphenacylsulfonium,ferrocenium salt, triarylsulfonium salt and the like; and mixtures ofthese free radical and/or cationic UV curing catalysts.

A surface of the conductive nanomaterial layer of the component 1 may becoated with the lamination formulation by using any suitable coatingmethod. For example, such coating may be applied by using a slot die, acoma coater, a silk screen printing method, a gravure method. Equipmentfor such method is commercially available. A slot die or comma coatermethod may be used. Coating thickness of the liquid lamination layer onthe surface of the component 1 may vary in the range of 30 nanometers to30 micrometers, or in the range of 100 nanometers to 10 micrometers.

The conductive nanomaterial layer may be a porous layer. During thecoating of the liquid lamination layer on the conductive nanomateriallayer of the component 1, part of the liquid lamination formulation maypenetrate into the pores of the conductive nanomaterial layer, forming alayer comprising conductive nanomaterial and the liquid lamination(“lamination liquid and conductive nanomaterial mixing layer”) as shownin FIG. 6-1B. A “component 2” comprising the protective film, thelamination liquid and conductive nanomaterial mixing layer, and theliquid lamination layer may thereby be prepared.

A “component 3” comprising the transparent substrate, the hard coat, andthe functional coating may be prepared as follows, as shown in FIGS. 7,1C and 1D. The component 3 may be prepared in a preparation lineseparate to that used in preparation of the component 2.

The hard coat may be formed on the back surface of the transparentsubstrate by any solution deposition method, such as dip coating, spraycoating, Mayer rod coating, slot die coating, screen printing and othertraditional coating methods followed by any suitable curing method suchas thermal curing, UV curing, infrared (IR) curing and the like. Forexample, a formulation containing silica nanoparticles and UV curablemonomer or oligomers comprising acrylates, methacrylates, epoxy functiongroups, a photo initiator, and an optional solvent may first bedeposited, and then cured on the said surface by UV light. Formulationsand methods of deposition of hard coats on polymer substrates are knownin the art. For examples of such formulations and methods, seepublications: U.S. Pat. No. 7,173,778 “Stain Repellent Optical HardCoating” to Naiyong Jing et al.; European Patent Application PublicationNo. 2275841 A2 “Manufacturing Method of Hard Coat Liquid and PlasticLens Manufacturing Method Thereof” to Kojima, H. et al.; and U.S. Pat.No. 8,247,468 B2 “Composition for Hard Coat, Article Having Hard CoatLayer and Method for Producing the Article” to Yoneyama K. et al. Theentire contents of these publications are incorporated herein byreference.

The functional coating may be formed on the hard coat by any solutiondeposition method, such as dip coating, spray coating, Mayer rodcoating, slot die coating, and screen printing process.

The component 3 comprising the transparent substrate, the hard coat, andthe functional coating may thereby be prepared.

Then, the component 2 and the component 3 may be combined by alamination process, as shown in FIG. 8-1E. The lamination process may bea film-to-film lamination process or film-to-sheet lamination process,depending on the type of the transparent substrate. During thelamination process, lamination liquid may substantially or completelyfill all void volume between the transparent substrate and theprotective film. Also, during the lamination process, the laminationliquid may substantially or completely fill all void volume of the poresof the conductive nanomaterial layer. Excess lamination liquid may formthe liquid lamination layer. Any trapped air within and/or between thelayers may be driven off by applying appropriate pressures on thecomponent 2 and the component 3. For example, these two components maybe passed through two rolls that have a precise gap between them or byapplying a pressure on these two rolls.

After the lamination process, a UV curing of the combined components mayyield the transparent conductive electrode comprising the protectivefilm, the conductive nano-composite layer, the lamination layer, thetransparent substrate, the hard coat, and the functional coating, asshown in FIG. 8-1F.

Example 2. Preparation of a Transparent Conductive Electrode

In this example, a method for preparation of a transparent conductiveelectrode is disclosed. This is a method alternative to that disclosedin Example 1. The formulations, the thermal and UV curing methods, andthe coating methods used in this example are disclosed in Example 1above. This exemplary method is shown in FIGS. 9-11. The followingreference numerals are used in FIGS. 9-11: transparent conductiveelectrode 102, lamination layer 105, transparent substrate 106,conductive nano-composite layer 107, hard coat 108, functional coating109, protective film 110, conductive nanomaterial layer 113, liquidlamination layer 114, lamination liquid and conductive nanomaterialmixing layer 115, “component 1” 116, “component 3” 120, and “component4” 121.

In this example, the protective film is coated with the liquidnanomaterial dispersion. After the coating, the protective film may bethermally treated to remove the solvent and thereby to form a solidconductive nanomaterial layer on the surface of the protective film, asshown in FIG. 9-2A. A component 1 comprising the protective film and theconductive nano-material layer may thereby be prepared.

A “component 4” comprising the transparent substrate, the hard coat, thefunctional coating, and the liquid lamination layer may be prepared asfollows, as shown in FIG. 10, 2B-2D. The component 4 may be prepared ina preparation line separate to that used in preparation of thecomponent 1. The component 3 may be prepared by following the samemethod disclosed in Example 1 above. The liquid lamination layer may bedeposited on the transparent substrate of the component 3 as shown inFIG. 2D, thereby forming the component 4.

Then the component 1 and the component 4 may be combined by thelamination process, as shown in FIG. 11-2E. After the laminationprocess, a UV curing of the combined components may yield thetransparent conductive electrode comprising the protective film, theconductive nano-composite layer, the lamination layer, the transparentsubstrate, the hard coat, and the functional coating, as shown in FIG.11-2F.

Example 3. A High Throughput Preparation of a Transparent ConductiveElectrode

In this example, a high throughput method for preparation of atransparent conductive electrode is disclosed. This exemplary method isshown in FIG. 12.

This method may use a first unwinding roll to release the protectivefilm, a first slot die coater to coat the nanomaterial dispersion, atunnel oven for the thermal treatment, a second slot die coater, asecond unwinding roll for coating of the transparent substrate, a rolllaminator and a UV curing system, and a rewinding roll.

Example 4. Preparation of a Touch Sensor

In this example, a method for preparation of a touch sensor isdisclosed. This exemplary method is shown in FIG. 13. The followingreference numerals are used in FIG. 13: touch sensor 101, transparentconductive electrode 102, sensor layer 104, lamination layer 105,transparent substrate 106, conductive nano-composite layer 107, hardcoat 108, functional coating 109, protective film 110, and “component 5”122.

Preparation of the transparent conductive electrode is disclosed above.First, the protective film may be peeled off of the transparentconductive electrode. Due to weak adhesion between the protective filmand the conductive nano-composite layer, the protective film may easilybe peeled off exposing the conductive nano-composite layer, as shown inFIG. 13-3A.

Then, the conductive nano-composite layer is patterned by using anysuitable method, for example, a laser lithography method, as shown inFIG. 13-3B. Equipment for the laser lithography may commercially beavailable. For example, the laser lithography equipment from ShengXiongLaser Equipment Inc. (Dongguan, China) may provide a pattern controlledat line widths as small as about 20 micrometers with etching speeds ofabout 1500 millimeters/second (mm/s). In this method, the nanomaterialin the conductive nano-composite layer may absorb more laser energy thanthe nano-material layer polymer. This difference in absorption allowsselective etching of the nanomaterial from the conductive nano-materiallayer. Depth of the laser etching (or ablation) may generally be in therange of 50 nanometers to 1 micrometer thickness where the conductivenano-composite layer is located.

After this laser patterning of the conductive nano-composite layer, atouch sensor comprising a sensor layer, a lamination layer, atransparent substrate, a hard coat and a functional coating may therebybe obtained.

Example 5. Preparation of an Encapsulated Touch Sensor

In this example, a method for preparation of an encapsulated touchsensor is disclosed. This exemplary method is shown in FIGS. 14-15. Thefollowing reference numerals are used in FIGS. 14-15: touch sensor 101,encapsulated touch sensor 103, sensor layer 104, lamination layer 105,transparent substrate 106, hard coat 108, functional coating 109,protective film 110, encapsulation layer 111, bonding area 112, liquidencapsulation layer 117, primer layer 118, “component 5” 122, “component6” 123, and “component 7” 124.

First, the sensor layer of the touch sensor prepared in Example 5 iscoated with a liquid encapsulation layer as shown in FIG. 14-4A. Aliquid formulation may be used to form the liquid encapsulation layer(“liquid encapsulation formulation”). Any suitable formulation may beused as the liquid encapsulation formulation. For example, the liquidlamination formulation may be used as the liquid encapsulationformulation.

The liquid encapsulation formulation may comprise a monomer or anoligomer, and a curing catalyst. For example, the liquid encapsulationformulation may comprise a monofunctional monomer, di-functionalmonomer, and tri-functional monomer, and a compatible catalyst. Acomposition of the liquid encapsulation formulation may comprise amono-functional monomer (1%-50%), a di-functional monomer (10-80%), atri-functional monomer (1-50%), a curing catalyst 1-6%, a leveling agent(0.1%-0.3%), and an antioxidant (0.1%-0.3%).

Examples of monomers that are useful in preparation of the liquidencapsulation formulation may be acrylate, methacrylate, acrylic acid,methacrylic acid, urethane acrylate, polyisocyanurate acrylate,acrylamide, methacrylamide, styrene, methyl styrene, polyester acrylate,polyurethane acrylate, polyimide acrylate, various epoxides, and amixture thereof. Examples of the curing catalyst may be free radicalcatalysts such as benzoin, benzoin alkyl ethers, acylphosphine oxides,1,1-diethoxyacetophenone, 1-benzoylcyclohexanol, benzophenone,2,2-dimethoxy-2-phenylacetophenone,2-methyl-1-[4-(methylthio)phenyl]-2-(4-morpholinyl)-1-propanone,1-hydroxycyclohexyl phenyl ketone, and the like; and cationic UV curingcatalysts such as diaryliodonium salt, dialkylphenacylsulfonium,ferrocenium salt, triarylsulfonium salt and the like; and mixtures ofthese free radical and/or cationic UV curing catalysts.

Thickness of the liquid encapsulation layer deposited on the sensorlayer may vary in the range of 1 micrometer to 30 micrometers, or 5micrometers to 10 micrometers. This coating layer may be formed by anysuitable method, for example, slot die, comma coater, silk screenprinting, gravure, and other method known in the art. For example, aslot die or comma coater method may be used. Equipment for suchprocesses is commercially available.

After the coating with the liquid layer, a component 5 comprising theliquid encapsulation layer, a sensor layer, a lamination layer, atransparent substrate, a hard coat and a functional coating may therebybe obtained.

In a separate process, a protective film may be coated with a primerlayer as shown in FIG. 14-4B. In this process, the primer layer maypartially cover a surface of the protective film. A component 6 maythereby be obtained. A primer manufactured by PT Hutchins in China wasused in the deposition of the primer layer. The primer may providestrong adhesion between the protective film and the encapsulation layer.When the protective film was lifted off, the encapsulation layerunderneath the primer layer was removed together with the protectivefilm so that the bonding area of the sensor may be formed.

Then, the component 5 may be combined with component 6 by placing thecomponent 6 on a surface of the component 5 as shown in FIG. 14-4C.During this placement, a surface of the primer layer may face a surfaceof the liquid encapsulation layer such that when these two componentsare brought in touch with each other, forming the component 7.

Then, the liquid layer of the component 7 is cured into a solid layer byapplying a UV curing method, as shown in FIG. 14-4D. Finally, theprotective film may be peeled off from the component. An encapsulatedtouch sensor comprising an encapsulation layer, a bonding area, a sensorlayer, a lamination layer, a transparent substrate, a hard coat, and afunctional coating may thereby be prepared, as shown in FIG. 14.

Example 6. Preparation of a Transparent Conductive Electrode Comprisinga Highly Transparent Poly(ethylene Terephthalate) Substrate

In this example, a highly transparent PET film was used as a transparentsubstrate. Thickness of this film was about 100 micrometers and itstransmittance was about 92.5% at about 550 nm. Another highly thermalstable PET film was used as protective film in preparation of atransparent conductive electrode. This PET film also had a high thermalstability. Its linear thermal expansion rate was about 0.5% and about1.0% at horizontal and vertical directions respectively. Silver nanowirewas used as a nanomaterial. This silver nanowire, with an averagediameter of about 35 nm, was purchased from Zhejiang Kechuang AdvancedMaterial Co. Ltd. Monomer for the lamination liquid formulation waspurchased from Sartomer Inc. These monomers included SR285, SR238 NS,SR351 NS, SR256, SR350 NS, SR508 NS, SR 601 NS, SR348 L, CN989 NS, SR368NS, CN9010 NS. Catalysts and antioxidants used in this example Irgacure754, Irgacure 184, and Irganox 1010 are purchased from BASF.

The conductive nanomaterial layer comprising the silver nanowire, andthe liquid lamination layer were formed on the PET film by using a Mayerrod on a drawdown machine model FA-202D from FUAN enterprises in China.Thermal treatment of the coating layers was performed in a regular oven,model DGG-9070A from Shanghai Sengxing Equipment Inc. in China. UVcuring of the liquid lamination layer, and the lamination liquid andconductive nanomaterial mixing layer was achieved by using a conveyorbelt system made by Jiangsu RUCHAO Inc. in China, which was equippedwith Fusion F300s as a UV light source. Transmittance of the transparentconductive electrode was measured by using a UV-VIS-NIR spectrometer.Sheet resistance of the transparent conductive electrode was measured byfour probe method by R-CHEK model RC2175 from EDTM (Electronic Design toMarket Inc.).

The process disclosed in Example 1 was followed. A nanomaterialdispersion comprising about 3.5 mg/milliliter silver nanowire, methanol,and isopropanol was coated on a highly thermal stable PET film by usinga #13 Mayer rod at a speed of about 150 mm/s. This coating was first airdried for about 1 minute, and then heated in an oven at about 150degrees centigrade for about 5 minutes to form a component 1. After thecomponent was cooled down, a liquid lamination layer was applied on thesilver nanowire layer by using a #8 Mayer rod to form a component 2.Then, the component 2 was combined with another highly transparent PETfilm by a lamination process, as shown in FIG. 8-1E. Excess laminationliquid and trapped air within and/or between the layers were driven offby applying appropriate pressures on the combined components between tworolls. UV curing of the combined components at a belt speed of about 3meter/minutes yielded a transparent conductive electrode comprising thePET protective film, the conductive nano-composite layer, the laminationlayer, and the highly transparent PET substrate without hard coat. Afterthe PET protective film is peeled off, the measured transmittance of theelectrode structure as shown in FIG. 2 was about 89% at about 550 nm, asshown in FIG. 16, and the sheet resistance of the electrode was about35±5 ohm/square. This electrode passed the adhesion test.

Example 7. Preparation of a Transparent Conductive Electrode Comprisinga Highly Transparent Poly(ethylene Terephthalate) Substrate with a HardCoat

This experiment was carried out in the same manner disclosed in Example6, except that a one side hard coated PET film was used as a highlytransparent substrate. This film was purchased from Zhong Yi Chemical,Inc. in China. Pencil hardness of this hard coat was 4H. Thickness ofthe PET film was about 100 micrometers.

The process disclosed in Example 2 was followed. A nanomaterialdispersion comprising about 3.5 mg/milliliter silver nanowire, methanol,and isopropanol was coated on a highly thermal stable PET film by usinga #13 Mayer rod at a speed of about 150 mm/s. This coating was first airdried for about 1 minute, and then heated in an oven at about 150degrees centigrade for about 5 minutes to form a component 1. Thecomponent was cooled down to room temperature within 10 minutes to forma component 1.

Another highly transparent PET film was first coated with a liquidlamination layer by using a #8 Mayer rod to form a component 4, and thencombined with the component 1 by using a lamination process, as shown inFIG. 11-2E. After the lamination process, a UV curing of the combinedcomponents at a belt speed of about 3 meter/minute yielded a transparentconductive electrode comprising the PET protective film, the conductivenano-composite layer, the lamination layer, the highly transparent PETsubstrate, and the hard coat without additional functional coating.After the protective film was peeled off, the measured transmittance ofthe transparent conductive electrode was about 89% at about 550 nm asshown in FIG. 17 and its sheet resistance was about 35±5 ohm/square.This electrode passed the adhesion test.

Example 8. Preparation of a Transparent Conductive Electrode Comprisinga Transparent Poly(methacrylate) (PMMA) Substrate

This experiment was carried out in the same manner disclosed in Example6, except that a PMMA sheet was used as a highly transparent substrate.Its pencil hardness was about 3H. Thickness of the PMMA sheet was about0.8 mm.

The process disclosed in Example 1 was followed. A silver nanowiredispersion containing about 3.5 mg per milliliter in a mixture ofmethanol and isopropanol was coated on a highly thermal stability PETfilm by using a #13 Mayer rod at a speed of about 150 mm/s. After thecomponent was air dried for about 1 minutes, it was heated in an oven atabout 150 degrees centigrade for about 5 minutes to form a component 1.After the component was cooled down, a liquid lamination layer wasapplied on the silver nanowire layer by using a #8 Mayer rod to form acomponent 2. The component 2 was then combined with the highlytransparent PMMA sheet by using a lamination process to form component3, as shown in FIG. 8-1E. Excess lamination liquid and trapped airwithin and/or between the layers were driven off by applying anappropriate pressure on the component between two rolls.

A UV curing of the combined components at a belt speed of about 3meter/minutes yielded a transparent conductive electrode comprising thePET protective film, the conductive nano-composite layer, the laminationlayer, and the highly transparent PMMA substrate. After the protectivefilm was peeled off, the measured transmittance was about 89% at about550 nm as shown in FIG. 18. The sheet resistance of the electrode wasabout 35±5 ohm/square. The electrode passed the adhesion test.

Example 9. Repeatable Preparation of a Transparent Conductive ElectrodeComprising a Transparent PMMA Substrate

In this example, the process disclosed in Example 2 was followed. Asilver nanowire dispersion containing about 3.5 mg nanowire permilliliter in a mixture of methanol and isopropanol was coated on a highthermal stability PET film by using a #13 Mayer rod at a speed of about150 mm/s. After the component was air dried for about 1 minute, it washeated in an oven at about 150 degrees centigrade for about 5 minutesand cooled down to room temperature within 10 minutes to form acomponent 1.

On a highly transparent PMMA sheet, a liquid lamination layer wasapplied by using a #8 Mayer rod to form a component 4 and combined withcomponent 1 by the lamination process, as shown in FIG. 11-2E. After thelamination process, a UV curing of the combined components at a beltspeed of about 3 meter/minute yielded a transparent conductive electrodecomprising a PET protective film, a conductive nano-composite layer, alamination layer, and a transparent PMMA substrate. Four samples wereprepared following the same process. After the protective film waspeeled off, the measured transmittance of these samples was about 89% atabout 550 nm, as shown in FIG. 19. The sheet resistance of these sampleswas about 35±5 ohm/square. They passed the adhesion test.

Example 10. Environmental Stability of Transparent Conductive ElectrodesPrepared by Using Various Liquid Lamination Formulations

Samples were prepared in the same manner disclosed in Example 6, exceptthat eight different lamination liquid formulations were used. After aUV curing, these formulations formed polymer lamination layers and thepolymer composites in the conductive nano-composite layer. Thesepolymers may be categorized into four different polymer types: aliphaticpolyacrylate, aromatic polyacrylate, polyurethaneacrylate, andpolyurethane acrylate-polyisocyanurate acrylate. Eight transparentconductive electrodes comprising a PET protective film, a nano-compositelayer, a lamination layer, and a highly transparent PET substrate wereprepared. Environmental tests were performed with half of the protectivePET protective film peeled off (exposed area) and the other half of theprotective PET still covering surface of the nano-composite layer(covered area). The sheet resistance of the exposed area of theelectrodes was monitored by 4-probe method during the test. The PET filmwas peeled off from covered area after about 240 hours and the sheetresistance of the electrodes was measured. Table 1 shows results ofenvironmental tests carried out at about 90% relative humidity and about60 degrees centigrade. Table 2 shows high temperature tests carried outat about 80 degrees centigrade. The results shows that the samples withprotective film covered area, the sheet resistance remain stable.

TABLE 1 Environmental tests of the transparent conductive electrodesprepared by using various lamination formulations. These tests arecarried out at about 90% relative humidity and about 60 degreescentigrade for duration of 0, about 120 hours, and about 240 hours.Polymer type in lamination and nano- Exposed area(Ω/□) Covered area(Ω/□)composite layer sample 0 h 120 h 240 h 240 h Aliphatic polyacrylate A-135 42 47 40 A-2 38 289 301 40 Aromatic polyacrylate B-1 36 — — 40 B-2 331068 — 39 Polyurethane acrylate C-1 35 43 48 39 C-2 40 47 50 38Polyurethaneacrylate- D-1 42 61 64 42 polyisocyanurate D-2 39 62 63 40acrylate

TABLE 2 Environmental tests of the transparent conductive electrodesprepared by using various lamination formulations. These tests arecarried out at about 80 degrees centigrade for duration of 0, about 120hours, and about 240 hours. Polymer type in lamination and nano- Exposedarea(Ω/□) Covered area(Ω/□) composite layer Sample 0 h 120 h 240 h 240 hAliphatic polyacrylate A-1 41 41 42 37 A-2 36 93 70 40 Aromaticpolyacrylate B-1 35 50 59 41 B-2 38 38 49 39 Polyuretahneacrylate C-1 4454 49 41 C-2 37 53 67 40 Polyurethane acrylate- D-1 39 46 41 40polylsocyanurate D-2 44 70 55 52 acrylate

Example 11. Preparation of a Touch Sensor Comprising a Transparent PETSubstrate

The transparent conductive electrode comprising a PET protective film anano-composite layer, a lamination layer, and a highly transparent PETsubstrate was prepared as disclosed above. A sensor layer was formed byusing this electrode by following the laser ablation process disclosedin Example 4. After the laser ablation process, a sensor layer patternof a touch area and an edge conducting channel shown in FIG. 20 wasobtained. The linewidth of the laser ablation was about 30 micrometers.

Example 12. Preparation of a Touch Sensor Comprising a Transparent PMMASubstrate

The transparent conductive electrode comprising a PET protective film anano-composite layer, a lamination layer, and a transparent PPMMAsubstrate was prepared as disclosed in Example 8. A sensor layer wasformed by using this electrode by following the laser ablation processdisclosed in Example 4. After the laser ablation process, a sensor layerpattern of a touch area and an edge conducting channel shown in FIG. 21was obtained. The linewidth of the laser ablation was about 30micrometers.

Example 13. Preparation of an Encapsulated Touch Sensor Comprising aTransparent PET Substrate

A touch sensor comprising a touch sensor layer, a lamination layer, atransparent PET substrate was prepared as disclosed in Example 12. Theencapsulation layer was formed on this touch sensor by following theprocess disclosed in Example 5. An IC bonding area is shown onupper-left corner of the microscopic photograph of FIG. 22, and theencapsulated area is shown in the lower right side of the photograph.

Example 14. Encapsulated Nano-Composite Touch Sensor with PMMA asTransparent Substrate

A touch sensor comprising a touch sensor layer, a lamination layer, atransparent PMMA substrate was prepared as disclosed in Example 13. Theencapsulation layer was formed on this touch sensor by following theprocess disclosed in Example 5. An IC bonding area is shown onupper-left corner of the microscopic photograph of FIG. 23, and theencapsulated area is shown in the lower right side of the photograph.

Any combination of above features, systems, devices, and methods arewithin the scope of this disclosure.

The components, steps, features, objects, benefits, and advantages thathave been discussed are merely illustrative. None of them, nor thediscussions relating to them, are intended to limit the scope ofprotection in any way. Numerous other embodiments are also contemplated.These include embodiments that have fewer, additional, and/or differentcomponents, steps, features, objects, benefits, and/or advantages. Thesealso include embodiments in which the components and/or steps arearranged and/or ordered differently.

Unless otherwise stated, all measurements, values, ratings, positions,magnitudes, sizes, and other specifications that are set forth in thisspecification, including in the claims that follow, are approximate, notexact. They are intended to have a reasonable range that is consistentwith the functions to which they relate and with what is customary inthe art to which they pertain.

All articles, patents, patent applications, and other publications thathave been cited in this disclosure are incorporated herein by reference.

The phrase “means for” when used in a claim is intended to and should beinterpreted to embrace the corresponding structures and materials thathave been described and their equivalents. Similarly, the phrase “stepfor” when used in a claim is intended to and should be interpreted toembrace the corresponding acts that have been described and theirequivalents. The absence of these phrases from a claim means that theclaim is not intended to and should not be interpreted to be limited tothese corresponding structures, materials, or acts, or to theirequivalents.

The scope of protection is limited solely by the claims that now follow.That scope is intended and should be interpreted to be as broad as isconsistent with the ordinary meaning of the language that is used in theclaims when interpreted in light of this specification and theprosecution history that follows, except where specific meanings havebeen set forth, and to encompass all structural and functionalequivalents.

Relational terms such as “first” and “second” and the like may be usedsolely to distinguish one entity or action from another, withoutnecessarily requiring or implying any actual relationship or orderbetween them. The terms “comprises,” “comprising,” and any othervariation thereof when used in connection with a list of elements in thespecification or claims are intended to indicate that the list is notexclusive and that other elements may be included. Similarly, an elementpreceded by an “a” or an “an” does not, without further constraints,preclude the existence of additional elements of the identical type.

None of the claims are intended to embrace subject matter that fails tosatisfy the requirement of Sections 101, 102, or 103 of the Patent Act,nor should they be interpreted in such a way. Any unintended coverage ofsuch subject matter is hereby disclaimed. Except as just stated in thisparagraph, nothing that has been stated or illustrated is intended orshould be interpreted to cause a dedication of any component, step,feature, object, benefit, advantage, or equivalent to the public,regardless of whether it is or is not recited in the claims.

The abstract is provided to help the reader quickly ascertain the natureof the technical disclosure. It is submitted with the understanding thatit will not be used to interpret or limit the scope or meaning of theclaims. In addition, various features in the foregoing detaileddescription are grouped together in various embodiments to streamlinethe disclosure. This method of disclosure should not be interpreted asrequiring claimed embodiments to require more features than areexpressly recited in each claim. Rather, as the following claimsreflect, inventive subject matter lies in less than all features of asingle disclosed embodiment. Thus, the following claims are herebyincorporated into the detailed description, with each claim standing onits own as separately claimed subject matter.

The invention claimed is:
 1. A process for making an electronic system,comprising: preparing a first component by a process comprising formingan electrically conductive nano-composite layer on a first protectivefilm; providing a transparent substrate; providing a liquid laminationlayer; bringing the liquid lamination layer in contact with theelectrically conductive nano-composite layer and the transparentsubstrate; curing the liquid lamination layer; and thereby preparing theelectronic system with the first protective film, wherein the electronicsystem comprises: the electrically conductive nano-composite layer; thelamination layer; and the transparent substrate; wherein theelectrically conductive nano-composite layer, the lamination layer, andthe transparent substrate each has a front surface and a back surface;wherein the lamination layer is formed on the front surface of thetransparent substrate; wherein the electrically conductivenano-composite layer is formed on the front surface of the laminationlayer; wherein the lamination layer is positioned between theelectrically conductive nano-composite layer and the transparentsubstrate; and wherein the front surface of the electrically conductivenano-composite layer is in contact with the first protective film. 2.The process of claim 1, wherein the liquid lamination layer comprisesmonomers that have one or more ultraviolet (UV) light curable functionalgroups.
 3. The process of claim 2, wherein the monomers are acrylates,methacrylates, acrylic acids, methacrylic acids, urethane acrylates,acrylamides, methacrylamides, styrenes, methyl styrenes, isocyanurateacrylates, polyester acrylates, polyurethane acrylates, polyimideacrylates, epoxides, or a mixture thereof.
 4. The process of claim 2,wherein the liquid lamination layer further comprises a catalystsuitable for a UV curing of the monomers, and an antioxidant.
 5. Theprocess of claim 1, further comprising forming a hard coat on the backsurface of the transparent substrate before bringing the liquidlamination layer in contact with the electrically conductivenano-composite layer and the transparent substrate; wherein the hardcoat has a front surface and a back surface; and wherein the frontsurface of the hard coat is in contact with the back surface of thetransparent substrate.
 6. The process of claim 5, further comprisingforming a functional coating on the back surface of the hard coat. 7.The process of claim 1, wherein the process of preparing the firstcomponent further comprises forming the liquid lamination layer on theback surface of the electrically conductive nano-composite layer.
 8. Theprocess of claim 1, further comprising bringing the liquid laminationlayer in contact with the front surface of the transparent substratebefore bringing the liquid lamination layer in contact with the backsurface of the electrically conductive nano-composite layer.
 9. Theprocess of claim 1, wherein the electrically conductive nano-compositelayer comprises a nanomaterial, and the process of claim 1 furthercomprises forming a touch sensor by first peeling off the firstprotective film and then partially removing the nanomaterial with apredetermined amount from the electrically conductive nano-compositelayer in such a manner that the electronic system can detect a touch.10. The process of claim 9, wherein the nanomaterial is removed with apredetermined amount from the electrically conductive nano-compositelayer by using a laser lithography process.
 11. The process of claim 9,further comprising: preparing a second component by a process comprisingforming a primer layer on a second protective film, wherein the secondprotective film has a front surface and a back surface, and wherein theprimer layer partially covers the front surface of the second protectivefilm; providing a liquid encapsulation layer; bringing the liquidencapsulation layer in contact with the front surface of theelectrically conductive nano-composite layer, the primer layer, and thefront surface of the second protective film; curing the liquidencapsulation layer; peeling off the second protective film; and therebypreparing an encapsulated touch sensor.
 12. The process of claim 11,wherein the liquid lamination layer and the liquid encapsulation layereach comprises monomers that have one or more UV curable functionalgroups.
 13. The process of claim 12, wherein the monomers are acrylates,methacrylates, acrylic acids, methacrylic acids, urethane acrylates,acrylamides, methacrylamides, styrenes, methyl styrenes, isocyanurateacrylates, polyester acrylates, polyurethane acrylates, polyimideacrylates, epoxides, or a mixture thereof.
 14. The process of claim 12,wherein the liquid lamination layer and the liquid encapsulation layereach further comprises a catalyst suitable for a UV curing of themonomer, and an antioxidant.
 15. The process of claim 14, wherein: theencapsulation layer is a layer prepared by polymerization of a liquidencapsulation formulation comprising a mono-functional monomer, adi-functional monomer, a tri-functional monomer, a curing catalyst, aleveling agent, and an antioxidant; thickness of the lamination layer isin the range of more than 1 micrometer to 20 micrometers, theelectrically conductive nano-composite layer comprises a nanomaterialand a polymer, and the lamination layer comprises a polymer.
 16. Theprocess of claim 1, wherein thickness of the transparent substrate is ina range of 0.01 millimeter to 6 millimeters.
 17. The process of claim16, wherein the thickness of the transparent substrate is in a range of0.02 millimeter to 0.20 millimeter.
 18. The process of claim 17, whereinthickness of the electrically conductive nano-composite layer is in arange of 5 nanometers to 1,000 nanometers.
 19. The process of claim 18,wherein thickness of the electrically conductive nano-composite layer isin the range of 30 nanometers to 100 nanometers.
 20. The process ofclaim 19, wherein the electrically conductive nano-composite layer, thelamination layer, and the transparent substrate form a component; andwherein optical transparency of said component is higher than 88% atabout 550 nm.